High Temperature Oxidation Resistant Rolled Copper Foil

Application：Mainly used in electronic products, PCB circuit board, 5G products, 3C products, LED light belt, new energy vehicles, cable and other industries.

Characteristic：It has excellent thermal conductivity, electrical conductivity and flexibility.

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Printed Circuit Board

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Technical speciﬁcation

Test item		unit	Properties
Test item		unit	12 μm	18 μm	35 μm	50 μm	70 μm
Content of copper		%	≥99.90	≥99.90	≥99.90	≥99.90	≥99.90
Mass area ratio		g/㎡	89-125	142-178	294-329	427-463	605-641
Thickness tolerance		μm	±2	±2	±2	±3	±3
width tolerance		mm	±1.5	±1.5	±1.5	±1.5	±1.5
Surface roughness	Plane (Ra)	μm	≤0.35	≤0.35	≤0.35	≤0.35	≤0.35
(Rm) Tensile strength	20℃	N/m㎡	≥350	≥370	≥370	≥370	≥370
(Rm) Tensile strength	180℃*0.5h	N/m㎡	≥130	≥150	≥170	≥170	≥170
(A50) Elongation	20℃	%	≥0.5	≥1.0	≥1.0	≥1.0	≥1.0
(A50) Elongation	180℃*0.5h	%	≥3	≥5	≥7	≥10	≥10
oxidation resistance	180℃*1h	_	Non-oxidation	Non-oxidation	Non-oxidation	Non-oxidation	Non-oxidation
Holes, wrinkles, scratches		_	Not have	Not have	Not have	Not have	Not have