Surface Blackened Treatment Rolled Copper Foil

Application：Mainly used in mobile phone circuit boards, automotive electronics, precision robots and other high-end fields.

Characteristic：The product has excellent bending resistance, chemical resistance and tin welding heat resistance, high peel strength and other characteristics.

hwywfzb@htgd.com.cn

+86-15084626001

Category：

Electronic

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Technical speciﬁcation

Test item		Unit	Properties
Test item		Unit	12μm	18μm	35µm	50µm	70μm
Content of copper		%	≥99.90	≥99.90	≥99.90	≥99.90	≥99.90
Mass area ratio		g/㎡	89-125	142-178	294-329	427-463	605-641
Thickness tolerance		μm	±2	±2	±2	±3	±3
Width tolerance		mm	±1.5	±1.5	±1.5	±1.5	±1.5
Surface roughness	S-plane (Ra)	μm	≤0.35	≤0.35	≤0.35	≤0.35	≤0.35
Surface roughness	M-plane (Rz)	μm	≤2.5	≤2.5	≤2.5	≤2.5	≤2.5
(Rm) Tensile strength	20℃	N/m㎡	≥350	≥370	≥370	≥370	≥370
(Rm) Tensile strength	180℃*0.5h	N/m㎡	≥130	≥150	≥170	≥170	≥170
(A50) Elongation	20℃	%	≥0.5	≥1.0	≥1.0	≥1.0	≥1.0
(A50) Elongation	180℃*0.5h	%	≥3	≥5	≥7	≥10	≥10
Oxidation resistance	180℃*1h	-	Non-oxidation	Non-oxidation	Non-oxidation	Non-oxidation	Non-oxidation
Peel strength		N/mm	≥0.6	≥0.6	≥0.6	≥0.6	≥0.6
Holes, wrinkles, scratches		-	Not have	Not have	Not have	Not have	Not have